We are delighted to announce that CEZAMAT WUT and CEA-Leti are joining forces to shape the future of European semiconductor technologies.

Last Thursday, at our center, we signed a cooperation agreement with CEA-Leti—one of Europe’s leading research institutes in micro- and nanoelectronics. During the event, Prof. Mariusz Malinowski, Warsaw University of Technology, H.E. Mr. Etienne de PONCINS, Ambassador of France in Poland, and Dariusz Standerski, Secretary of State at the Ministry of Digital Affairs of Poland, highlighted the strategic role of Franco-Polish collaboration and the need to support the development of secure and competitive semiconductor capabilities in Europe.

This partnership represents a concrete step toward advancing cutting-edge technologies and strengthening Europe’s technological sovereignty.

The signed Memorandum of Understanding establishes a long-term collaboration in microelectronics, photonics, and microsystems—based on joint technology development and tangible research and development activities.

The cooperation will focus in particular on:

• joint development and implementation of FD-SOI technologies,
• development of radiation-hardened (rad-hard) technologies,
• collaborative work on advanced microelectronics solutions,
• development of IoT technologies and their applications,
• strengthening the position of FD-SOI within the European ecosystem.

This partnership brings tangible benefits:

• combining the expertise of two leading research centers in Europe,
• development of joint R&D projects and participation in European initiatives,
• access to unique research infrastructure and its effective sharing,
• development of talent and competencies in strategic technological areas,
• strengthening the European semiconductor value chain.

Since the late 1990s, the Warsaw University of Technology has been actively developing SOI technologies—collaborating, among others, with INPG (Francis Balestra, Sorin Cristoloveanu) and participating in projects such as SINANO and NONSIL.

Today, we continue this path within the FAMES Pilot Line (led by CEA-Leti) and through work on new initiatives under the EU Chips 2.0 program (RESOLVE).

This event would not have been possible without the contributions of many individuals and organizations:

• Embassy of France in Poland – Aurelien Prevost, Pierre Aymard
• CEA-Leti – Jean-René Lèquepeys, Bruno Paing, Thierry Poiroux
• CEZAMAT WUT – Mariusz Wielec, Aleksandra Mościcka-Studzińska, Prof. Romuald Beck, PhD Eng. Piotr Wiśniewski, Arkadiusz Hruszowiec

We are launching a collaboration built on shared ambitions and complementary expertise. This partnership strengthens the European semiconductor ecosystem and creates a solid foundation for the continued development of advanced technologies.