We offer the possibility of producing photolithographic masks by electronolithography on our own or supplied substrates.

We offer an ion implantation process for electronics, optoelectronics, spintronics, among others

We offer the performing of a diffusion process for applications in micro- and nanoelectronics, photonics or photovoltaics and micromechanics.

We offer a process for annealing large batches of semiconductor substrates in a controlled manner.

We offer rapid thermal annealing processes for silicon substrates with heating rates up to 200 °C/s.

We offer bonding of substrates manufactured from a variety of materials, including semiconductor materials (silicon and others) and dielectrics (glass, ceramics and others), for use in microelectronics, nanoelectronics, photonics and microsystems

Electronolithography, or electron-beam lithography, allows patterns to be written directly onto the resist layer, resulting in possible feature dimensions at the level of single nanometers

We offer the complete photolithography process, starting with substrate preparation, application of the resist layer, exposure and development, up to hardening (preparation for wet or dry etching).

We offer magnetron sputtering for applications including semiconductor electronics, photovoltaics, optoelectronics.

We offer Plasma Enhanced Chemical Vapour Deposition (PECVD) for applications including nanoelectronics, photonics, micromechanics, passivation, encapsulation or masking layers

We offer a process for oxidizing large batches of silicon substrates in a controlled and reproducible manner.

We offer processes for the chemical vapour deposition of polysilicon and silicon nitride films under reduced pressure (Low Pressure Chemical Vapor Deposition).

We offer deposition of thin films of oxide materials by Pulsed Laser Deposition.

We offer etching of a variety of substrates and deposited layers using wet-chemical processes.

We offer ICP/RIE plasma etching (ICP – Inductively Coupled Plasma, RIE – Reactive Ion Etching)

We offer cleaning of silicon substrates, quartz substrates and photolithographic masks.

We offer efficient and reproducible processes for cleaning large batches of silicon substrates and preparing them for further process steps.

We offer sample characterization using a high-resolution scanning electron microscope (HRSEM) Auriga 60 from Carl Zeiss

We perform complete ellipsometric measurements of samples.

We offer concept testing, modeling, and simulation of structures, instruments, systems, and processes.

The consulting offer includes actions concerning the implementation of technology for the manufacture.

We offer preparation of materials for printing techniques for dedicated applications.

We measure current, voltage, capacitance, current frequency and resistance (2-wire and 4-wire).

We measure the viscosity of non-Newtonian liquids, record liquidity curves, and determine the function of non-Newtonian liquids under sustained flow rate behavior conditions

We offer testing in a climate chamber.

We test the strength of materials in tension and compression.

We offer the development of printed electronics, flexible electronics, and textronics solutions for the required application.

We offer scaling of printing technologies to industrial scale – preparation for implementation into production, including concept testing, digital modeling, and simulation of products, their components, and processes.

We offer 2D/3D bioprints using the Direct Printing Dispenser, Drop-on-Demand, or Fused Deposition Modelling.

We offer functional prints on three-dimensional substrates (e.g., spheres, hemispheres, cylindrical substrates) by Aerosol Jet Printing

We offer specialized consulting in the analysis of solutions in the field of printed electronics.

Wire bonding is a technique used in microelectronics to establish electrical connections between a semiconductor structure (e.g., an integrated circuit) and the leads of a package or a substrate, such as a printed circuit board (PCB).